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Advanced Thermal Interface Materials

Published online by Cambridge University Press:  26 February 2011

Yimin Zhang ,
Allison Xiao  and
Jeff McVey
Yimin Zhang
Affiliation:
[email protected], National Starch and Chemical Company, Corporate Research Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States, 908-685-5697, 908-685-7400
Allison Xiao
Affiliation:
[email protected], National Starch and Chemical Company, Corporate Technology Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States
Jeff McVey
Affiliation:
[email protected], National Starch and Chemical Company, Corporate Technology Group, 10 Finderne Avenue, Bridgewater, NJ, 08807, United States
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Abstract

Thermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs. This paper discusses the current state-of-art TIM solutions, particularly fusible particles for improved thermal conductivity. The paper will address the benefits and limitations of this approach, and describe a system with unique filler morphology. Thermal resistance and diffusivity/conductivity characterization techniques are also discussed.

Keywords

thermal conductivitysinteringalloy
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V05-10
Copyright
Copyright © Materials Research Society 2007

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References

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