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Advanced Laser Diode Cooling Concepts

Published online by Cambridge University Press:  01 February 2011

Ryan Feeler ,
Jeremy Junghans ,
Edward Stephens ,
Greg Kemner ,
Fred Barlow ,
Jared Wood  and
Aicha Elshabini
Ryan Feeler
Affiliation:
[email protected], Cutting Edge Optronics, Laser Diode Packaging, 20 Point West Boulevard, St. Charles, MO, 63301, United States, 6369164900
Jeremy Junghans
Affiliation:
[email protected], Cutting Edge Optronics, 20 Point West Boulevard, St. Charles, MO, 63301, United States
Edward Stephens
Affiliation:
[email protected], Cutting Edge Optronics, 20 Point West Boulevard, St. Charles, MO, 63301, United States
Greg Kemner
Affiliation:
[email protected], Cutting Edge Optronics, 20 Point West Boulevard, St. Charles, MO, 63301, United States
Fred Barlow
Affiliation:
[email protected], University of Idaho, Electrical Engineering, Buchanan Engineering, Room 213, PO Box 441023, Moscow, ID, 83844-1023, United States
Jared Wood
Affiliation:
[email protected], University of Idaho, Electrical Engineering, Buchanan Engineering, Room 213, PO Box 441023, Moscow, ID, 83844-1023, United States
Aicha Elshabini
Affiliation:
[email protected], University of Idaho, Electrical Engineering, Buchanan Engineering, Room 213, PO Box 441023, Moscow, ID, 83844-1023, United States
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Abstract

A new, patent-pending method of cooling high-power laser diode arrays has been developed which leverages advances in several areas of materials science and manufacturing. This method utilizes multi-layer ceramic microchannel coolers with small (100's of microns) integral water channels to cool the laser diode bar. This approach is similar to the current state-of-the-art method of cooling laser diode bars with copper microchannel coolers. However, the multi-layer ceramic coolers offer many advantages over the copper coolers, including reliability and manufacturing flexibility. The ceramic coolers do not require the use of deionized water as is mandatory of high-thermal-performance copper coolers.

Experimental and modeled data is presented that demonstrates thermal performance equal to or better than copper microchannel coolers that are commercially available. Results of long-term, high-flow tests are also presented to demonstrate the resistance of the ceramic coolers to erosion. The materials selected for these coolers allow for the laser diode bars to be mounted using eutectic AuSn solder. This approach allows for maximum solder bond integrity over the life of the part.

Keywords

ceramiclaserIII-V
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1076: Symposium K – Materials and Devices for Laser Remote Sensing and Optical Communication , 2008 , 1076-K07-06
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1. Truesch, Georg et al. , “Reliability of Water Cooled High Power Diode Laser Modules,” proc. of SPIE 5711, 132–141 (2005).Google Scholar
2. Haake, John and Faircloth, Brian, “Requirements for Long Life Micro-Channel Coolers for Direct Diode Laser Systems,” proc. of SPIE 5711, 121–131 (2005).Google Scholar
3. Feeler, Ryan et al. , “Elimination of Deionized Cooling Water Requirement for Microchannel-Cooled Laser Diode Arrays,” proc. of SPIE 6456, 645617 (2007).Google Scholar
4. Feeler, Ryan et al. , “Next-Generation Microchannel Coolers,” proc. of SPIE 6876 (2008).Google Scholar
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