Published online by Cambridge University Press: 02 January 2015
Ensuring microstructural stability under technical relevant conditions is a determining criterion for the development of innovative high-temperature materials. In this work, the influ-ence of C and Si on the microstructural stability during creep exposure was investigated for a β-solidifying γ-TiAl based alloy with a nominal composition of Ti-43.5Al-4Nb-1Mo-0.1B (in at.%), named TNM. With a two-step heat treatment a microstructure consisting of fine lamellar α2/γ-colonies, surrounded by βo-phase and areas of discontinuous precipitation, starting from the boundaries of the lamellar colonies, was adjusted. Creep tests were carried out to examine the potential of C and Si to prevent microstructural instability during creep and hence improving the creep properties. At 815 °C the discontinuous precipitation process of the TNM alloy continues during ensuing creep testing leading to a reduced creep resistance. In comparison, the minimum creep rate of the TNM-0.3C-0.3Si alloy was significantly decreased caused by the lower βo-phase content and average lamellar spacing within the α2/γ-colonies, the precipitation of p-Ti3AlC carbides and the retarded kinetics of discontinuous precipitation.