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Adhesion Strength of Cu/Polyimide Interfaces by Micro-Wedge Scratching

Published online by Cambridge University Press:  22 February 2011

F. Wang ,
J.C. Nelson ,
H. Huang ,
R. L. Swisher  and
W.W. Gerberich
F. Wang
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
J.C. Nelson
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
H. Huang
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
R. L. Swisher
Affiliation:
Sheldahl Inc. Northfield, MN 55057
W.W. Gerberich*
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
*
To whom the correspondence should be addressed
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Abstract

The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 pm wide, 0.1 μm radius wedge-shapeddiamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1.μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Loaddisplacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 571
Copyright
Copyright © Materials Research Society 1994

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References

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