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Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

Published online by Cambridge University Press:  15 February 2011

E. C. Ahn
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
T. C. Oh
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
I. S. Park
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
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Abstract

CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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