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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

Published online by Cambridge University Press:  01 February 2011

Jae-Hoon Song ,
Ja-Hyung Han ,
Yi-Koan Hong ,
Young-Jae Kang ,
Jin-Goo Park ,
Ju-Ho Maeng  and
Young-Man Won
Jae-Hoon Song
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Ja-Hyung Han
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Yi-Koan Hong
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Young-Jae Kang
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Jin-Goo Park
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Ju-Ho Maeng
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
Young-Man Won
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, [email protected]
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Abstract

The adhesion force of pad and alumina were experimentally and theoretically investigated in slurry solutions of different pHs. The isoelectric point (IEP) of pad particles was measured to be around pH 3. The wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. Cu and Ta showed higher interaction forces than dielectric materials. The lowest adhesion force was measured between pad particle and wafer surfaces in a slurry solution of pH 11. The magnitude of adhesion force of pad particles was lower than alumina particles.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W1.9
Copyright
Copyright © Materials Research Society 2005

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