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Adhesion of Copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) Surfaces Modified by Vacuum UV Photo-oxidation Downstream from Argon Microwave Plasma

Published online by Cambridge University Press:  01 February 2011

W. Dasilva ,
A. Entenberg ,
B. Kahn ,
T. Debies  and
G. A. Takacs
W. Dasilva
Affiliation:
Department of Chemistry, Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, U.S.A
A. Entenberg
Affiliation:
Department of Physics, RIT, Rochester, NY 14623, U.S.A
B. Kahn
Affiliation:
Department of Imaging & Photographic Technology, RIT, Rochester, NY 14623, U.S.A
T. Debies
Affiliation:
Xerox Corporation, Webster, NY 14580, U.S.A
G. A. Takacs
Affiliation:
Department of Chemistry, Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, U.S.A
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Abstract

Good practical adhesion of sputter-deposited Cu is achieved to poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar microwave (MW) plasma. Factors contributing to the adhesion include: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of the surface; (4) cross-linking at the surface and (5) incorporation of oxygen as CF-O-CF2, CF2-O-CF2 and CF-O-CnF2n+1 moieties. With long treatment times, a cohesive failure occurred within the modified PFA and not at the Cu-PFA interface due to extensive chain scission weakening its mechanical properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 851: Symposium NN – Materials for Space Applications , 2004 , NN9.2
Copyright
Copyright © Materials Research Society 2005

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References

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