Hostname: page-component-cd9895bd7-p9bg8 Total loading time: 0 Render date: 2024-12-27T02:23:21.641Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion Measurements of Thin Films by Several Methods

Published online by Cambridge University Press:  22 February 2011

Akira Kinbara ,
Tatsuya Banno ,
Ichiharu Kondo  and
Osamu Takenaka
Akira Kinbara
Affiliation:
Kanazawa Institute of Technology, Department of Mechanical Engineering, Nonoichi, Ishikawa 921, Japan
Tatsuya Banno
Affiliation:
The University of Tokyo, Department of Applied Physics, Tokyo 113, Japan
Ichiharu Kondo
Affiliation:
Nippondenso Co.Ltd., Kariya, Aichi 448, Japan
Osamu Takenaka
Affiliation:
Nippondenso Co.Ltd., Kariya, Aichi 448, Japan
Get access

Abstract

Adhesion of thin films to solid substrates has been measured by various methods. In addition to the traditional and the conventional methods, a novel method has been proposed. The adhesion is expressed by various units depending on the measuring method. Obtained values by typical or well known methods such as scratch, peel and pull method are expressed in terms of N, N/m and N/m2, respectively. Relation among these quantities was discussed. The interface structure between the films and the substrates was investigated by TEM, ED, EDS, etc. and was related to the adhesion. Particular attention was paid to the ion bombardment effect of the substrate on the adhesion.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 91
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Benjamin, P. and Weaver, C., Proc.Roy. Soc. A254(1960)163 Google Scholar
2 Hintermann, H.E., J.Vac.Sci.Technol. B2(1984)816 Google Scholar
3 Baba, S., Kikuchi, A. and Kinbara, A., J.Vac.Sci.Technol. A4(1986)3015 Google Scholar
4 Baba, S., Kikuchi, A. and Kinbara, A., J.Vac.Sci.Technol. A5(1986)1860 Google Scholar
5 Yoon, I.B., Jpn.J.appl.Phys., Suppl. 2 Pt1(1974)849 Google Scholar
6 Yang, W.M.C., Tsakalakos, T. and Hilliard, J.E., J.Appl. Phys. 48(1977)876 Google Scholar
7 Small, M.K., Vlassak, J.J. and Nix, W.D., Mat.Res.Soc. Symp.Proc. 239(1992)257 Google Scholar
8 Jeong, H.S., Chu, Y.Z., Freiler, M.B., Durning, C. and White, R.C., Mat.Res.Soc.Symp.Proc. 239(1992)547 Google Scholar
9 Kondo, I., Yoneyama, T., Takenaka, O. and Kinbara, A., J. Vac.Sci.Technol. A10(1992)3456 Google Scholar
10 Kinbara, A. and Baba, S., Thin Solid Films 163(1988)Google Scholar
11 Kinbara, A. and Baba, S., Proc. Joint ASME/JSME Advances in Electronic Packaging, 1992, p1 Google Scholar
12 Kinbara, A. and Kondo, I., Adhesion, J. Sci. Technol. 7 (1993)767 Google Scholar
13 Ferrante, J., Bozzolo, G.H., Finley, C.W. and Banerjea, A., Mat.Res.Soc.Symp.Proc. 119(1988)3 Google Scholar
14 Benjamin, P. and Weaver, C., Proc.Roy.Soc. A254(1960)163 Google Scholar