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Adhesion Behavior of PIQ to Si/SiO2 Surfaces

Published online by Cambridge University Press:  25 February 2011

O. C. de Hodgins ,
D. R. Uhlmann ,
G. C. Tesoro  and
J. Angilello
O. C. de Hodgins
Affiliation:
IBM Corporation, DSD, Poughkeepsie, N.Y., and Massachusetts Institute of Technology, Physics Department, Cambridge, Mass. 02139
D. R. Uhlmann
Affiliation:
Department of Materials Science and Engineering, M.I.T., Cambridge, Mass. 02139
G. C. Tesoro
Affiliation:
Polytechnic Institute of flew York
J. Angilello
Affiliation:
T.J. Watson Research Center, IBM Corporation, Yorktown Heights, N.Y. 10598.
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Abstract

The present paper reports the results of an investigation of the adhesion characteristics of PIQ13, an isoindaloquin-azolinedione-modified polyimide, to silicon wafers. The wafers were used both untreated and pretreated with a layer of CVD SiO2. Also investigated was the adhesion behavior of a condensation-type polyimide, P15878. A comparison is made between the behavior of the PIQ with two different coupling agents, an aluminum chelate (Coupler 3) and γ-aminopropyltriethoxy silane (A-1100). Superior adhesion performance of the A-1100 is indicated; and with A-1100, the adhesion of the two resins is similar.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 139
Copyright
Copyright © Materials Research Society 1986

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References

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