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Adhesion and Progressive Debonding of Polymer/Metal Interfaces: Effects of Temperature and Environment

Published online by Cambridge University Press:  10 February 2011

Seung-Yeop Kook ,
Amol Kirtikar  and
Reinhold H. Dauskardt
Seung-Yeop Kook
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford CA 94305
Amol Kirtikar
Affiliation:
Assembly Technology, Intel Corporation, Chandler, AZ 85226
Reinhold H. Dauskardt
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford CA 94305
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Abstract

The interfacial fracture properties of a representative polymer/metal interface commonly found in microelectronic applications are examined. The double cantilever beam (DCB) configuration was used to investigate the effects of environmental variables on interfacial adhesion and progressive delamination under monotonic and cyclic fatigue loading conditions. The steady-state interfacial fracture energy, Gss, taken from the plateau of the R-curve, of a representative silica-filled Phenol-Novolac epoxy on a Nielectroplated Cu substrate showed little sensitivity to the presence of moisture. On the other hand, both the initiation interfacial fracture energy, Gi, and the entire progressive debond curve under fatigue loading were remarkably sensitive to moisture and temperature, respectively. Debonding is modeled in terms of interface structure, chemistry using chemical reaction rate theory, and relaxation process at the debond tip. The activation energy for stage I debond growth is found to be 140 kJ/mol and 63 kJ/mol for stage II for the current polymer/metal interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 563: Symposium M – Materials Reliability in Microelectronics IX , 1999 , 263
Copyright
Copyright © Materials Research Society 1999

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