Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-06T12:22:17.078Z Has data issue: false hasContentIssue false

X-Ray Residual Stress Measurement in Films with Crystallographic Texture and Grain Shape

Published online by Cambridge University Press:  15 February 2011

L. G. Yu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
B. C. Hendrix
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
K. W. Xu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
J. W. He
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
H. C. Gu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
Get access

Abstract

X-ray diffraction provides an easy and powerful method for measuring residual stress in thin films. However, nonlinearity of the d vs. sin2ψ relation can lead to the misinterpretation of results, especially when one of the measurements is made at low values of ψ relation for different combinations of ideal crystallographic textures and grain shapes are given. In all cases, a high ψ angle range exists where the d vs. sin2ψ relation in the low ψ angle range.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Noyan, I.C. and Cohen, J.B., Residual Stress: Measurement by Diffraction and Interpretation, (Springer-Verlag Publishers, New York Inc., 1987).Google Scholar
2. Perry, A.J., Jagner, M., Spraul, W.D. and Rudnik, P.J., Surface and Coating Technology, 42, 49 (1990); A.J. Perry, ibid., 41, 231 (1990).Google Scholar
3. Sazaki, T., Kuramoto, M. and Yoshioka, Y., Nondestructive Inspection, 39(4), (1991), (In Japanese).Google Scholar
4. Yu, L.G., Xu, K.W. and He, J., Proc. of 4th Int. Conf. on Residual stress. June 8 -10, 1994, Baltimore, (Published by the Society for Experimental Mechanics, Inc.) pp195201.Google Scholar
5. Dolle, H. and Hauk, V., Z. Metallkde., 69, 410 (1978).Google Scholar
6. Krier, J., Ruppersberg, H., Berveiller, M. and Lipinski, P., Textures and Micro-structures. 14–18, 1147 (1991).Google Scholar
7. Eckhardt, M. and Ruppersberg, H., Textures and Micro-structures, 8 & 9, 679 (1988).Google Scholar
8. Mura, T., Micro-mechanics of Defects in Solids, (Martinus Nijhoff Publishers, The Hague, Netherlands, 1982).Google Scholar
9. Voigt, W., Lehrbuch der Kristallphysik, (Teubner, Leibzig/Berlin, 1928).Google Scholar
10. Reuss, A., Z. Angew. Math. Mech. 9, 49 (1929).Google Scholar
11. Kroner, E., Z. Physik., 151, 504 (1958).Google Scholar
12. Hill, R., Proc. Phy. Soc. A 65, 349 (1952).Google Scholar
13. Hendrix, B.C., Yu, L.G., Xu, K.W. and He, J.W., in the same symposium.Google Scholar
14. Fillit, R.Y. and Perry, A.J., Surface and Coatings Techn., 36, 647 (1988).Google Scholar
15. Perry, A.J., Thin Solid Films, 214, 169 (1992).Google Scholar
16. Yu, L.G., Sun, H.L., Xu, K.W. and He, J.W., J. Appl. Crystall., 27, 863 (1994).Google Scholar
17. Bridgman, P.W., Proc. Am. Acad. Arts Sci., 64, 19 (1929).Google Scholar