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Published online by Cambridge University Press: 25 February 2011
A highly sensitive x-ray fluorescence (XRF) technique has been developed for the determination of low metal concentrations in the etch resistant layer of surface-imaged photoresists. The samples may be analyzed quickly and the method is applicable to a wide variety of surfaceimaging processes. For each metal of interest the XRF spectrometer is easily calibrated using polymer films containing known concentrations of a metal-containing reagent. Examples of the application of this technique to the analysis of Ti, Si and Zr-containing films are described.