Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-23T10:52:05.110Z Has data issue: false hasContentIssue false
  • English
  • Français

Wireless Remote 2-D Strain Sensor using SAW Delay Line

Published online by Cambridge University Press:  01 February 2011

Toru Nomura  and
Atushi Saitoh
Toru Nomura
Affiliation:
[email protected], Shibaura Institute of Technology, Faculty of Engineering, Tokyo, Japan
Atushi Saitoh
Affiliation:
[email protected], Shibaura Institute of Technology, Faculty of Engineering, Tokyo, Japan
Get access

Abstract

Two-dimensional (2-D) strain sensor utilizing surface acoustic wave (SAW) devices is demonstrated. SAW devices offer many attractive features for applications as chemical and physical sensors. In this paper, a novel SAW strain sensor that employs SAW delay lines has been designed. Two crossed delay lines were used to measure the two-dimensional strain. A wireless sensing system is also proposed for effective operation of the strain sensor.

Keywords

acousticsensorstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1129: Symposium V – Materials and Devices for Smart Systems III , 2008 , 1129-V04-17
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Varadan, V.K., Smart Materials and Structural Systems, no.1–1, pp. 135–148 (2001).Google Scholar
2. Wohltjen, H. and Dessy, R., Analytical Chem., vol.51, no.9, pp. 1485–1475 (1979).Google Scholar
3. Wohltjen, H., in Proc. of 4th International Conference on Solid sensors and actuators, Tokyo, p. 471 (1987).Google Scholar
4. Motamedi, M.E. and White, R.M., IEEE Trans. Ultrson. Ferroelec. Freq. Conr., vol. UFFC-34, no.2, pp.122, (1987).Google Scholar
5. Pohl, A., “A review of wireless SAW sensors”, IEEE Trans. Ultrson. Ferroelec. Freq. Conr., vol.47, no.2, pp.317–332, March, (2000).Google Scholar
6. Hauden, D., Bindler, F., Coquerel, R., in Proceedings of IEEE 1985 Ultrasonics Symposium, pp 486–2489 (1985).Google Scholar
7. Scherr, H., Scholl, G., Seifert, F. and Weigel, R., in Proc. of 1996 IEEE Ultrasonics Symposium, pp. 347–350 (1996).Google Scholar
8. Hayasaka, J., Tanaka, K., Miura, T., Ikeda, Y., and Kuwano, H., in Proc.of the 23rd Sensor Symposium, pp. 455–458 (2006).Google Scholar
9. Nomura, T., Saitoh, A. and Tokuyama, H., in Proc. of the 20th Sensor Symposium, pp. 191–194 (2003).Google Scholar