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Void Intergranual Motion Under the Action of Electromigration Forces in Thin Film Interconnects with Bamboo Structure

Published online by Cambridge University Press:  21 March 2011

Ersin Emre Oren  and
Tarik Omer Ogurtani
Ersin Emre Oren
Affiliation:
Department of Metallurgical and Materials Engineering Middle East Technical University, 06531, Ankara, Turkey
Tarik Omer Ogurtani
Affiliation:
Department of Metallurgical and Materials Engineering Middle East Technical University, 06531, Ankara, Turkey
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Abstract

The rigorous formulation of the internal entropy production, and the generalized forces and conjugate fluxes associated with the virtual displacement of a triple junction are presented in multi-component systems. Extensive computer simulations are performed on the void configurational evolution during the intergranual motion; under the actions of capillary and electromigration forces in thin film metallic interconnects with bamboo structure having various grain textures. The texture studies in this work show clearly that there are two different and very distinct modes, namely: the grain boundary carving or tearing mode, and the interconnect edge cutting mode by the oblique slit formation (about 450) on the wind-side of the grain boundary.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L5.5.1
Copyright
Copyright © Materials Research Society 2002

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References

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