Hostname: page-component-745bb68f8f-5r2nc Total loading time: 0 Render date: 2025-02-05T15:24:26.906Z Has data issue: false hasContentIssue false
  • English
  • Français

Various methods used to etch titanium dioxide columnar thin films

Published online by Cambridge University Press:  31 January 2011

Martin Roman Kupsta ,
Mike Taschuk ,
Michael J. Brett  and
Jeremy C. Sit
Martin Roman Kupsta
Affiliation:
[email protected], University of Alberta, Electrical and Computer Engineering, ECERF W2-023, Edmonton, Canada
Mike Taschuk
Affiliation:
[email protected], University of Alberta, Electrical and Computer Engineering, ECERF W2-023, Edmonton, Canada
Michael J. Brett
Affiliation:
[email protected], University of Alberta, Electrical and Computer Engineering, ECERF W2-023, Edmonton, Canada
Jeremy C. Sit
Affiliation:
[email protected], University of Alberta, Electrical and Computer Engineering, ECERF W2-023, Edmonton, Canada
Get access

Abstract

A dry etch recipe was developed for porous nanostructured TiO2 thin films fabricated using glancing angle deposition (GLAD). Unlike wet chemical etches, the technique reported here preserves the vertical post nanostructure, eliminating clumping. A highly controllable and easily tailored reactive ion etching process with CF4 alone, or combined with O2, was investigated. The anisotropic etch modifies the morphology and density of standard GLAD films, which is of interest for sensing applications.

Keywords

sensorreactive ion etchingnanostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1174: Symposium V – Functional Metal-Oxide Nanostructures , 2009 , 1174-V10-04
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Hawkeye, M. and Brett, M. “Glancing angle deposition: Fabrication, properties, and applications of micro- and nanostructured thin films”, J. Vac. Sci. Technol. A5, 1317–1335 (2007).Google Scholar
[2] Zhou, X. Virasawmy, S. Knoll, W. Liu, K. Yu, Tse, M. Siu and Yen, L. Wei, “Profile simulation and fabrication of gold nanostructures by separated nanospheres with oblique deposition and perpendicular etching”, Plasmonics 2, 217–230 (2007).Google Scholar
[3] Lakhtakia, A. and Horn, M. “Bragg-regime engineering by columnar thinning of chiral sculptured thin films”, Optik 144, 556–560 (2003).Google Scholar
[4] Pursel, S. Horn, M. and Lakhtakia, A. “Tuning of sculptured-thin-films spectral-hole filters by postdeposition etching”, Opt. Eng. 46, 1–3 (2007).Google Scholar
[5] Robbie, K. Cui, Y. Elliott, C. and Kaminska, K. “Oxidation of evaporated porous silicon rugate filters”, Appl. Opt. 45, 8298–8303 (2006).Google Scholar
[6] Summers, M. and Brett, M. “Thermal oxidation of periodically aligned silicon squarespirals”, Microelectron. Engin. 85, 1222–1224 (2008).Google Scholar
[7] Powell, O. and Sweatman, D. and Harrison, B.H. “The use of titanium and titanium dioxide as masks for deep silicon etching”, Smart Meter. Stuc. 15, S81–86 (2006).Google Scholar
[8] Matsuo, S. “Selective etching of SiO2 relative to Si by plasma reactive sputter etching”. J. Vac. Sci. Technol. 17, 587–594 (1980).Google Scholar
[9] Fan, J.G. Dyer, D. Zhang, G. and Zhao, Y.P.. “Nanocarpet effect: Pattern formation during the wetting of vertically aligned nanorod arrays”. Nanoletters 4, 2133–2138 (2004).Google Scholar
[10] Matsutani, A. Koyama, F. and Iga, K. “Microfabrication of dielectric multilayer reactor by reactive ion etching and characterization of induced wafer damage”, Jap. J. Appl. Phys. 30, 428–429 (1991).Google Scholar
[11] Szmigiel, D. Domanski, K. Prokaryn, P. Grabiec, P. and Sobczak, J.W. “The effect of fluorine-based plasma treatment on morphology and chemical surface composition of biocompatiblesilicone elastomers”, Appl. Surf. Sci. 253, 1506–1511 (2006).Google Scholar