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UV Curing Effects of Low-k Materials under Reactive Conditions

Published online by Cambridge University Press:  01 February 2011

Darren Moore ,
Carlo Waldfried ,
Palani Sakthivel  and
Orlando Escorcia
Darren Moore
Affiliation:
[email protected], Axcelis Technologies, Cleaning and Curing Systems, 108 Cherry Hill Drive, Beverly, MA, 02144, United States
Carlo Waldfried
Affiliation:
[email protected], Axcelis Technologies, 108 Cherry Hill Drive, Beverly, MA, 01915, United States
Palani Sakthivel
Affiliation:
[email protected], Axcelis Technologies, 108 Cherry Hill Drive, Beverly, MA, 01915, United States
Orlando Escorcia
Affiliation:
[email protected], Axcelis Technologies, 108 Cherry Hill Drive, Beverly, MA, 01915, United States
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Abstract

This work describes the effect of addition of O2 and NH3 to the N2 ambient used during the UV cure process of low-k materials. The effects of O2 give an acceleration of the cure process, resulting in increased film modulus and shrinkage. The use of NH3 resulted in a retardation of UV cure, explained by the higher absorption cross section of NH3 at the wavelengths used.

Keywords

dielectric propertiesthin filmfilm
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1079: Symposium N – Materials and Processes for Advanced Interconnects for Microelectronics , 2008 , 1079-N02-04
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

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