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Using Thermal Oxidation and Rapid Thermal Annealing on Polycrystalline-SiGe for Ge Nanocrystals

Published online by Cambridge University Press:  01 February 2011

Chyuan-Haur Kao
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan, +886-3-2118800-5783, +886-3-2118507
C. S. Lai
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
M. C. Tsai
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. H. Lee
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. S. Huang
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. R. Chen
Affiliation:
[email protected], Material Science Service Corporation, Hsin Chu, 300, Taiwan
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Abstract

In this paper, simple techniques were proposed to fabricate germanium nanocrystal capacitors by one-step thermal oxidation and/or rapid thermal annealing on polycrystalline-SiGe (poly-SiGe) deposited with a LPCVD (low pressure chemical vapor deposition) system. This thermal oxidation method can directly result in the top-control oxide layer via the oxidation of amorphous-Si film and the formation of Ge nanocrystals from the poly-SiGe film. Otherwise, the rapid thermal annealing method can be also used to form Ge nanocrystals as comparison.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

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