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Underfill Encapsulant Flow Measured using Capacitance Measurement Techniques

Published online by Cambridge University Press:  21 March 2011

T. E. Driscoll ,
G. L. Lehmann  and
E. J. Cotts
T. E. Driscoll
Affiliation:
Department of Physics, Binghamton University, Binghamton, N. Y. 13902
G. L. Lehmann
Affiliation:
Department of Mechanical Engineering, Binghamton University, Binghamton, N. Y. 13902
E. J. Cotts
Affiliation:
Department of Physics, Binghamton University, Binghamton, N. Y. 13902
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Abstract

Capillary flows of dense, model suspensions and industrial underfill encapsulants are investigated. Flow behavior is characterized by measuring the infiltration rate of an encapsulant or model suspension into a channel formed by parallel surfaces. A capacitance measurement technique is used to track the advancement of the front. Significantly this technique allows the channel surfaces to be formed from opaque materials such as those that found in the principal industrial application of electronics packaging. A scaling law to describe the functional dependence of the front position on channel spacing, surface tension and viscosity is presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N1.8
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

[1] Fine, P., Cobb, B., and Nguyen, L., “Flip Chip Underfill Flow Characterization and Prediction”, IEEE Trans. Comp. Pkg. Tech., vol. 23, no. 3, September 2000, pp. 420–427 Google Scholar
[2] Wong, C. P., Vincent, M. B., and Shi, S., “Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion”, IEEE Trans. Comp., Pkg., Mfg., Tech. - Part A, vol. 21, no. 2, June 1998, pp. 360–364 Google Scholar
[3] Han, S. and Wang, K. K., “Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips”, IEEE Trans. Comp., Pkg., Mfg., Tech. - Part B, vol. 20, no. 4, November 1997, pp.424–433 Google Scholar
[4] Ni, G., Gordon, M. H., Schmidt, W. F., and Selvam, R. P., “Flow Properties of Liquid Underfill Encapsulations and Underfill Process Considerations”, Proc. 49th Electron. Compon. Tech. Conf., pp. 101 – 108 Google Scholar
[5] Emerson, J. A. and Adkins, C. L. J., “Techniques for Determining the Flow Properties of Underfill Materials”, Proc. 49th Electon. Compon. Tech. Conf., pp. 777 – 783 Google Scholar
[6] Driscoll, T., Ph.D. Dissertation, Binghamton University, est. June 2001 Google Scholar
[7] Guo, Y., “Model of the Underfill Flow Process: Particle Distribution Effects”, Proc. 49th Electon. Compon. Tech. Conf., pp. 71 – 76 Google Scholar