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Ultraviolet Excimer Lamp Photoassisted Selective Palladium Activation of Coarse Grain 96% Alumina Ceramic for Selective Electroless Copper Plating

Published online by Cambridge University Press:  10 February 2011

D.J. Macauley ,
P.V. Kelly  and
G.M. Crean
D.J. Macauley
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland
P.V. Kelly
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland
G.M. Crean
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland
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Abstract

Selective electroless metallisation for electronic interconnect applications requires the selective activation of insulating substrate surfaces prior to plating. Photoselective activation has emerged as a solution with significant potential to minimise the number of activation process steps. This paper reports a photoselective activation process using ultraviolet excimer lamps to decompose a proprietary palladium‐based ultraviolet‐sensitive photochemical coating. The morphology of the photochemical coating, irradiation process conditions for decomposition to produce palladium metal activation sites, the morphology of the coating and activation, and the adhesion of electroless copper on coarse grain 96% alumina ceramic are reported. Copper feature resolution of better than 50 μm is demonstrated. The process is demonstrated to require photochemical solution concentrations an order of magnitude lower than reported palladium acetate activation processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 45
Copyright
Copyright © Materials Research Society 1997

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References

1 Deckert, C.A., Plating and Surface Finishing (1995 volume) 48–55, 58–64Google Scholar
2 Ni Dheasuna, C., Mathewson, A. and Spalding, T., Proc. ESSDERC, 1990, p129 Google Scholar
3 Val, C. and Leray, M., European patent 91.403307.1Google Scholar
4 Hirsch, T.J., Miracky, R.F. and Lin, C., Appi. Phys. Lett. 57 (1990) 1357 Google Scholar
5 Cole, H.S., Liu, Y.S., Rose, J.W., Guida, R. and Philipp, H.R., Appl.Phys. Lett. 53 (1988) 21.Google Scholar
6 Stuke, M., Esrom, H. and Wahl, G., US Patent No. 4,900,581.Google Scholar
7 Bergonzo, P., Patel, P., Boyd, I.W. and Kogelschatz, U.. Appi. Surf. Sci. 54 (1992) 424 Google Scholar
8 Esrom, H., Demny, J. and Kogelschatz, U., Chemtronics 4 (1989) 202 Google Scholar
9 Weaver, J.H. and Benbow, R.L., Phys. Rev. B12 (1975) 3509 Google Scholar
10 Lafferty, E.J., Macauley, D.J., Kelly, P.V. and Crean, G.M., MRS Fall Meeting (1996) Symposium Cb, submitted.Google Scholar