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Ultra high resolution, low temperature, direct metal patterning by selective laser processing of solution deposited metal nanoparticles

Published online by Cambridge University Press:  17 April 2019

Seung H. Ko ,
Dong Yeol Yang ,
Heng Pan ,
Jean M. Frechet ,
Yong Son ,
Tae Woo Lim ,
Junyeob Yeo  and
Costas. P. Grigoropoulos
Seung H. Ko
Affiliation:
Applied Nano Tech & Science lab, KAIST, Daejeon, Korea Laser Thermal Lab, University of California, Berkeley, California 94720-1740, USA
Dong Yeol Yang
Affiliation:
Laser Thermal Lab, University of California, Berkeley, California 94720-1740, USA
Heng Pan
Affiliation:
Laser Thermal Lab, University of California, Berkeley, California 94720-1740, USA
Jean M. Frechet
Affiliation:
Chemistry Dept., University of California, Berkeley, California 94720-1740, USA
Yong Son
Affiliation:
Applied Nano Tech & Science lab, KAIST, Daejeon, Korea
Tae Woo Lim
Affiliation:
Applied Nano Tech & Science lab, KAIST, Daejeon, Korea
Junyeob Yeo
Affiliation:
Applied Nano Tech & Science lab, KAIST, Daejeon, Korea
Costas. P. Grigoropoulos
Affiliation:
Applied Nano Tech & Science lab, KAIST, Daejeon, Korea
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Abstract

All-printed electronics is the key technology to ultra-low-cost, large-area electronics. As a critical step in this direction, we demonstrate that femtosecond laser processing (sintering and ablation) of solution deposited metal nanoparticles enables direct metal patterning at low-temperature with ultra high resolution (∼300nm) to overcome the resolution limitation of the current inkjet direct writing processes.

This could be explained by the combined effects of novel properties of metal nanoparticles such as melting temperature drop, strong absorption of the incident laser beam at surface plasmon mode, lower conductive heat transfer loss, and the relatively weak bonding between nanoparticles. Local thermal control of the laser sintering process could minimize the heat-affected zone and the thermal damage to the substrate and further enhance the resolution of the process. This local nanoparticle deposition and energy coupling enable an environmentally friendly and cost-effective process as well as a low-temperature manufacturing sequence to realize large-area, flexible electronics on polymer substrates.

Keywords

laser annealingnanostructuremetallic conductor
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1247: Symposium C – Solution Processing of Inorganic and Hybrid Materials for Electronics and Photonics , 2010 , 1247-C09-05
Copyright
Copyright © Materials Research Society 2010

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