Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-29T07:41:03.625Z Has data issue: false hasContentIssue false
  • English
  • Français

Time, Temperature and Strain Relaxation during Fabrication of Strained Heterostructures

Published online by Cambridge University Press:  28 February 2011

J.Y. Tsao  and
B.W. Dodson
J.Y. Tsao
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-5800
B.W. Dodson
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-5800
Get access

Abstract

We present a simple example of the time evolution of temperature, excess stress and strain relaxation during growth and subsequent annealing of strained heterostructures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 160 , 1989 , 17
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Osbourn, G.C., Gourley, P.L., Fritz, I.J., Biefeld, R.M., Dawson, L.R. and Zipperian, T.E., Semiconductors and Semimetals 24 (1987) 445.Google Scholar
2Dodson, B.W. and Tsao, J.Y., Ann. Rev. Materials Science, in press.Google Scholar
3 See, e.g., Ball, C.A.B. and van der Merwe, J.H., in Dislocations in Solids, Nabarro, F.R.N., ed. (North-Holland, 1983), Chap. 27.Google Scholar
4Matthews, J.W. and Blakeslee, A.E., J. Crystal Growth 27 (1974) 118.Google Scholar
5Tsao, J.Y., Dodson, B.W., Picraux, S.T. and Cornelison, D.M., Phys. Rev. Lett. 59 (1987) 2455.Google Scholar
6Dodson, B.W. and Tsao, J.Y., Appl. Phys. Lett. 51, 1325 (1987); Appl. Phys. Lett. 52 (1988) 852.Google Scholar
7Tsao, J.Y. and Dodson, B.W., Surf. Sci., in press.Google Scholar
8Tsao, J.Y. and Dodson, B.W., Appl. Phys. Lett. 53 (1988) 848.Google Scholar
9Bean, J.C., Sheng, T.T., Feldman, L.C., Fiory, A.T. and Lynch, R.T., Appl. Phys. Lett. 44 (1984) 102.Google Scholar
10Dodson, B.W. and Tsao, J.Y., Phys. Rev. B38, 383 (1988) and B.W. Dodson and J.Y. Tsao, Appl. Phys. Lett. 53 (1988) 2498.Google Scholar
11 Note, though, that without the stress-dependent activation energy a closed-form solution has been shown to exist [People, R., Appl. Phys. Lett. 53 (1988) 1127].Google Scholar
12 Using a simple linear interpolation between the melting temperatures of the pure components.Google Scholar
13Hull, R., Bean, J.C., Werder, D.J. and Leibenguth, R.E., Appl. Phys. Lett. 52 (1988) 1605.Google Scholar
14Hauenstein, R.J., Clemens, B.M., Miles, R.H., Marsh, O.J., Croke, E.T. and McGlll, T.C., J. Vac. Sci. Technol. B7, 767 (1989).Google Scholar