Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-19T06:49:29.363Z Has data issue: false hasContentIssue false
  • English
  • Français

Three Dimensional Simulation of the Microstructure Development in Ni-20%Fe Nanocrystalline Deposits

Published online by Cambridge University Press:  10 February 2011

Hualong Li ,
F. Czerwinski  and
J. A. Szpunar
Hualong Li
Affiliation:
Department of Metallurgical Engineering, McGill University, Montreal, PQ, Canada, H3A 2A7
F. Czerwinski
Affiliation:
Department of Metallurgical Engineering, McGill University, Montreal, PQ, Canada, H3A 2A7
J. A. Szpunar
Affiliation:
Department of Metallurgical Engineering, McGill University, Montreal, PQ, Canada, H3A 2A7
Get access

Abstract

A Monte-Carlo computer model was applied to simulate a development of the three dimensional microstructure during electrodeposition of nanocrystalline alloys. The driving force for this process was the minimization of free energy of the system. For a particular deposit of Ni-20%Fe, the influence of the overpotential and current density on the grain size was tested. A strong decrease in grain size with increasing overpotential and current density obtained from the simulation is in qualitative agreement with the experimental data.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 457: Symposium V – Nanophase and Nanocomposite Materials II , 1996 , 199
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Osmola, D., Remaud, E.. Erb, U., Wong, L., Palumbo, G. and Aust, K.T., Mat. Res. Soc. Symp. Proc. 286, p. 191 (1993)Google Scholar
2. McMahon, G. and Erb, U., J. Mat. Sci. Lett., 8, p. 865 (1993)Google Scholar
3. McMahon, G. and Erb, U., Microstr. Sci., 17, p. 447 (1989)Google Scholar
4. Li, D.Y. and Szpunar, J.A., Electroch. Acta, 42, 37, 47 (1989)Google Scholar
5. Li, D.Y. and Szpunar, J. A., Mat. Sci. Forum, 157–162, p. 1827–1838 (1994)Google Scholar
6. Fleischmann, and Thirsk, H.R., Advances in Electrochemistry and Electrochemical Engineering, 3, p. 123 (1963)Google Scholar
7. Li, Hualong, Czerwinski, F. and Szpunar, J.A., Nanostructured Materials, (in press)Google Scholar