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Thin Film Fine Line Work of Adhesion by Microwedge Indentation
Published online by Cambridge University Press: 21 February 2011
Abstract
The mechanics for plane strain geometry are presented for thin film fine lines by considering the case of microwedge indentation of a fine line subject to no residual stress. The analysis is separated into three parts depending on the absence or presence of buckling. During indentation, unbuckled or double-buckled configurations may exist, while single-buckling may occur when the indenter tip is removed. A microwedge tip was employed in the indentation testing of unstressed rf-sputtered tungsten fine lines to demonstrate some of the analysis.
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- Copyright © Materials Research Society 1995