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Thin Film Decohesion and Its Measurement

Published online by Cambridge University Press:  15 February 2011

A. Bagchi  and
A. G. Evans
A. Bagchi
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, MA 02138
A. G. Evans
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, MA 02138
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Abstract

The mechanics of thin films are used to define quantitative procedures for predicting interface decohesion motivated by residual stress. The emphasis is on the role of the interface debond energy, especially methods for its accurate and reliable measurement. Experimental results are reviewed and possible mechanisms are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 383: Symposium I – Mechanical Behavior of Diamond and Other Forms of Carbon , 1995 , 183
Copyright
Copyright © Materials Research Society 1995

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References

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