Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-27T01:46:01.815Z Has data issue: false hasContentIssue false

Thermoelectric Power of Bi And Bi1−xSbx Alloy Thin Films And Superlattices Grown by MBE

Published online by Cambridge University Press:  15 February 2011

Sunglae Cho
Affiliation:
Department of Physics and Astronomy, Northwestern University, Evanston, IL 60208
Antonio DiVenere
Affiliation:
Department of Physics and Astronomy, Northwestern University, Evanston, IL 60208
George K. Wong
Affiliation:
Department of Physics and Astronomy, Northwestern University, Evanston, IL 60208
John B. Ketterson
Affiliation:
Department of Physics and Astronomy, Northwestern University, Evanston, IL 60208
Jerry R. Meyer
Affiliation:
Code 5613, Naval Research Laboratory, Washington, D.C. 20375–5338
Craig A. Hoffmian
Affiliation:
Code 5613, Naval Research Laboratory, Washington, D.C. 20375–5338
Get access

Abstract

We have measured the thermoelectric power (TEP) of MBE-grown epitaxial Bi and Bi1−xSbx alloy thin films and superlattices as a function of temperature in the range 20–300 K. We have observed that the TEP of a Bi thin film of 1 μm thickness is in good agreement with the bulk single crystal value and that the TEPs for superlattices with 400 Å and 800 Å Bi well thicknesses are enhanced over the bulk values. For x=0.072 and 0.088 in Bi1−xSbx thin films showing semiconducting behavior, TEP enhancement was observed by a factor of two. However as Bi or Bi1−xSbx well thickness decreases in superlattice geometry, the TEP decreases, which may be due to unintentional p-type doping.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Gallo, C. F., Chandrasekhar, B. S., and Sutter, P. H., J. Appl. Phys. 34, 1963, 144.Google Scholar
2. DiVenere, A., Yi, X. J., Hou, C. L., Wang, H. C., Chen, J., Ketterson, J. B., Wong, G. K., Meyer, J. R., Hoffman, C. A., and Bartoli, F. J., J. Vac. Sci. Technol. B 12, 1994, 1136.Google Scholar
3. Hoffman, C. A., Meyer, J. R., Bartoli, F. J., DiVenere, A., Yi, X. J., Hou, C. L., Wang, H. C., Ketterson, J. B., and Wong, G. K., Phys. Rev. B 48, 1993, 11 43; Phys. Rev. B 51, 1995, 5535.Google Scholar
4. Hicks, L. D. and Dresselhaus, M. S., Phys. Rev. B 47, 1993, 12 727.Google Scholar
5. Hicks, L. D., Harman, T. C., and Dresselhaus, M. S., Appl. Phys. Lett. 63, 1993, 3230.Google Scholar
6. Sofo, J. O. and Mahan, G. D., Appl. Phys. Lett. 65, 1994, 2690.Google Scholar
7. Mahan, G. D. and Lyon, H. B. Jr.,, J. AppI. Phys. 76, 1994, 1899.Google Scholar
8. Broido, D. A. and Reiriecke, T. L., Phys. Rev. B 51, 1995, 13 797.Google Scholar
9. Broido, D. A. and Reinecke, T. L., Appl. Phys. Lett. 67, 1995, 100.Google Scholar
10. Lin-Chung, P. J., and Reinecke, T. L., Phys. Rev. B 51, 1995, 13 244.Google Scholar
11. Hicks, L. D., Harman, T. C., Sun, X., Dresselhaus, M. S., Phys. Rev. B. 53 10 493 (1996).Google Scholar
12. Jain, A. L., Phys. Rev. 114, 1518 (1959).Google Scholar
13. Heremans, J. and Michenaud, J.-P., J. Phys. C 18, 6033 (1985).Google Scholar
14. DiVenere, A., Yi, X. J., Hou, C. L., Wang, H. C., Ketterson, J. B., Wong, G. K., and Sou, I. K., Appl. Phys. Lett. 62, 1993, 2640.Google Scholar
15. Yi, X. J., Wang, H. C., DiVenere, A., Hou, C. L., Chen, J., Ketterson, J. B., and Wong, G. K., Appl. Phys. Lett. 64, 1994, 1283.Google Scholar
16. Cho, S., DiVenere, A., Wong, G. K., Ketterson, J. B., Meyer, J. R. and Hoffman, C. A. (accepted for publication in Solid State Communications).Google Scholar
17. Lenoir, B., Cassart, M., Michenaud, J.-P., Scherrer, H. and Scherrer, S., J. Phys. Chem. Solids, 57,1996, 89.Google Scholar
18. Morelli, D. T., Partin, D. L. and Heremans, J., Semicond. Sci. Technol. 5, 1990 S257.Google Scholar
19. Korenblit, I. Ya., Kusnetsov, M. E., and Shalyt, S. S., Soviet Phys. JETP, 29, 1969, 4.Google Scholar
20. Cho, S., DiVenere, A., Wong, G. K., Ketterson, J. B., Meyer, J. R. and Hoffman, C. A., Bulletin of APS March Meeting, Kasnsas City, MO, 1997, p273.Google Scholar