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Thermionic Refrigeration

Published online by Cambridge University Press:  10 February 2011

G. D. Mahan*
Affiliation:
Department of Physics and Astronomy, University of Tennessee, Knoxville, TN 37996, and Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831, [email protected]
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Abstract

The principles of thermionic refrigeration are explained. The simplest device is composed of two metal plates separated by a vacuum gap. This device is efficient at room temperature only for plates with small work functions (eø <0.3 eV). Small barriers are available in semiconductor-semiconductor interfaces (band off-sets) and in metal-semiconductor interfaces(Schottky barriers). An efficient refrigerator is modeled for these systems. Possible realizations are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

[1] Mahan, G.D., J. Appl. Phys. 76, 4362 (1994)CrossRefGoogle Scholar
[2] Mahan, G.D. and Woods, L.M., Phys. Rev. Lett. 80, 4016 (1998)CrossRefGoogle Scholar
[3] Mahan, G.D., Sofo, J.O. and Bartkowiak, M., J. Appl. Phys. 83, 4683 (1998)CrossRefGoogle Scholar
[4] Shakouri, A. and Bowers, J.E., Appl. Phys. Lett. 71, 1234 (1997)CrossRefGoogle Scholar
[5] Shakouri, A., Lee, E. Y., Smith, D. L., Narayanamurti, V. and Bowers, J. E., Microscale Thermophysical Engineering 2, 37 (1998)Google Scholar
[6] Goldsmid, H.J., Electronic Refrigeration (Pion Limited, London, 1986)Google Scholar
[7] Mahan, G.D., J. Appl. Phys. 65, 1578 (1989)CrossRefGoogle Scholar
[8] Mahan, G.D., Sales, B.C., and Sharp, J., Physics Today (March, 1996)Google Scholar
[9] Mahan, G.D., in Solid State Physics, vol. 51, ed. Ehrenreich, H. and Spaefen, F. (Academic Press, 1998) pg 81 Google Scholar
[10] Chen, G., Tien, C.L., Wu, X. and Smith, J.S., J. Heat transfer 116, 325 (1994)CrossRefGoogle Scholar
[11] Capinski, W.S. and Maris, H.J., Physica B 219 & 220, 699 (1996)CrossRefGoogle Scholar
[12] Lee, S.M., Cahill, D.G. and Venkatasubramanian, R., Appl. Phys. Lett. 70, 2957 (1997)CrossRefGoogle Scholar
[13] Venkatasubramanian, R. and Colpitts, T., in Thermoelectric Materials–New Directions and Approaches, ed. Hicks, T.M., and Kanatzidis, M.G., and Lyons, H.B. Jr, and Mahan, G.D. (MRS, Vol.478, 1997) pg 73 Google Scholar
[14] Hyldgaard, P. and Mahan, G.D., Phys. Rev. B 56, 10 754 (1997)CrossRefGoogle Scholar
[15] Chen, G. and Neagu, M., Appl. Phys. Lett. 71, 2761 (1997)CrossRefGoogle Scholar