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Thermally and Ion-Induced Reactions of Metal with CuO Substrate

Published online by Cambridge University Press:  25 February 2011

Jian Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
S. Q. Wang
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
J. W. Mayer
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

Thermally and ion-induced reactions of transition metals Zr, Ti, Cr and Ag with CuO substrates have been studied by Rutherford backscattering spectrometry and X-ray diffraction techniques. Reactions resulted in the configuration of ZrO2/Cu2O/CuO from Zr/CuO structure and TiOx/Cu2O from Ti/CuO structure after thermal annealing and ion irradiation. No significant reaction has been found in Cr/CuO after vacuum annealing at 410°C and 300 Key Xe ions irradiation at 240°C. Ag atoms balled up on CuO surface after annealing at 610°C. A comparison of the reaction layers has been made in both metal/SiO2 and metal/CuO systems after thermal annealing and ion irradiation. Both heats of reaction and bond strength in the substrates can influence the chemical reactivity between metal layer and substrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

REFERENCES

[1] Appleton, B.R., Naramoto, H., White, C.W., Holland, O., Mchargue, C., Farlow, G.C., Marayan, J.,Williams, J.M., Nucl. Instrum.Methods, B1 167,(1984).Google Scholar
[2] Baglin, J.E.E.,Clark, G.J., Nucl.Instrum.Methods, B7/8, 881, (1985).Google Scholar
[3] Farlow, G.C., Appleton, B.R., Boatner, L.A., Mchargue, C.J., White, C.W., Clark, G.J., Baglin, J.E.E., Mater.Res.Soc.Symp.Proc., ed. by Bieqelsen, P.K., Rozgonyi, G.A., and Shank, C.V. (MRS, Pittsburgh, 1985),V45, 137.Google Scholar
[4] Doolittle, L.R., Nucl.Instrum.Methods, B9, 344,(1985).Google Scholar
[5] Zhao, X.-A.,Kolawa, E. and Nicolet, M.-A., J.Vac.Sci. Technol. A4, 3139,(1986).Google Scholar
[6] Nicolet, M.-A. and Lau, S.S., in VLSI Electronics Microstructure Science,V6,ed.by Einspruch, N.G., (Academic press, 1983),453.Google Scholar
[7] The Oxide Hand book (second Edition),edited by Samsonov, G.V.,(IFI/Plenum,1982).Google Scholar
[8] Wang, S.Q. and Nayer, J.W., J.Appl.Phys., 64, 4711,(1988).Google Scholar
[9] Fehlner, F.P. and Mott, N.F., Oxid.Metals, 2,59,(1970).Google Scholar