Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-29T07:49:36.700Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Conductivity and Heat Transfer in Superlattices

Published online by Cambridge University Press:  15 February 2011

G. Chen ,
M. Neagu  and
T. Borca-Tasciuc
G. Chen
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
M. Neagu
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
T. Borca-Tasciuc
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
Get access

Abstract

Understanding the thermal conductivity and heat transfer processes in superlattice structures is critical for the development of thermoelectric materials and devices based on quantum structures. This work reports progress on the modeling of thermal conductivity of superlattice structures. Results from the models established based on the Boltzmann transport equation could explain existing experimental results on the thermal conductivity of semiconductor superlattices in both in plane and cross-plane directions. These results suggest the possibility of engineering the interfaces to further reduce thermal conductivity of superlattice structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 478: Symposium Q – Thermoelectric Materials - New Directions and Approaches , 1997 , 85
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Hicks, L.D., and Dresselhaus, M.S., Phy. Rev. B, 47, p. 12727–12731 (1993).Google Scholar
[2] Yao, T., Appl. Phys. Lett., 51, p. 1798–1800 (1987).Google Scholar
[3] Chen, G., Tien, C.L., Wu, X., and Smith, J.S., J. Heat Transf. 116, p. 325–331 (1994).Google Scholar
[4] Yu, X.Y., Chen, G., Verma, A., and Smith, J.S., Appl. Phys. Lett., 67, p. 3553–3556 (1995).Google Scholar
[5] Capsinski, W.S. and Maris, H.J., Physica B, 219&220, p. 699–701 (1996).Google Scholar
[6] Lee, S.-M., Cahill, D., and Venkatasubramanian, R., private communication (1997).Google Scholar
[7] Venkatasubramanian, R., Naval Research News, XLVIII, 31–43 (1996).Google Scholar
[8] Ren, S.Y. and Dow, J.D., Phys. Rev. B, 25, p. 3750–3755 (1982).Google Scholar
[9] Callaway, J., Phys. Rev., 113, p. 1046–1051 (1959).Google Scholar
[10] Chen, G., in ASME Proc. 31st National Heat Transf. Conf., HTD-323, p. 121–129 (1996), more details to appear in J. Heat Transf..Google Scholar
[11] Chen, G., in Micro-Electro-Mechanical-Systems (Proc. ASME Int. Mech. Eng. Congress), DSC-59, p. 13–24 (1996).Google Scholar
[12] Hyldgaard, P. and Mahan, G.D., in Thermal Conductivity 23, edited by Wilkes, K.E., Dinwiddie, R.B., and Graves, R.S. Technomic Publishing Co., Inc., 1996, p. 172–182.Google Scholar
[13] Majumdar, A., J. Heat Transf., 115, p. 7–16 (1993).Google Scholar
[14] Chen, G. and Tien, C.L., J. Thermophys. Heat Transf., 7, p. 311–318 (1993).Google Scholar
[15] Little, W.A., Can. J. Phys., 37, p. 334–349 (1959).Google Scholar
[16] Holland, M.G., Phys. Rev., A, 134, p. 471–480 (1964).Google Scholar
[17] Curruthers, P., Rev. Mod. Phys., 33, p. 92–138 (1961).Google Scholar
[18] Swartz, E.T. and Pohl, R.O., Rev. Mod. Phys., 61, p. 605–668 (1989).Google Scholar
[19] Bode, M.H. and Ourmazd, A., J. Vac. Sci. Techn., B, 10, p. 1787–1792 (1992).Google Scholar
[20] LeGoues, F.K., Meyerson, B.S., Morar, J.F., and Kirehner, P.D., J. Appl. Phys., 71, p. 4230–4243 (1992).Google Scholar
[21] Zheng, X.Y., Li, S.Z., Chen, M., and Wang, K.L., in Micro-Electro-Mechanical-Systems (Proc. ASME Int. Mech. Eng. Congress), DSC-59, p. 93–98 (1996).Google Scholar