Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-25T17:57:13.913Z Has data issue: false hasContentIssue false
  • English
  • Français

Theoretical Studies of Electromigration in Polycrystalline Metal Stripes

Published online by Cambridge University Press:  21 February 2011

Dimitris Maroudas  and
Sokrates T. Pantelides
Dimitris Maroudas
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Sokrates T. Pantelides
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
Get access

Abstract

A systematic analysis is presented of the mesoscopic mechanisms that govern the structural evolution of polycrystalline conductors under the action of applied electric fields. A recently derived set of general dynamical mesoscopic equations is specialized to study the behavior of microstructural building blocks. Scaling analysis is presented for the dynamics of the corresponding transport and micromechanical processes associated with a wide range of time scales. Results of numerical simulations are presented for vacancy migration along grain boundaries, evolution of current-induced stresses, surface diffusion, and void stability and growth. The calculated dependence of characteristic times on current density is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 333
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Black, J. R., Trans. IEEE, ED–16, 338 (1969).CrossRefGoogle Scholar
2. Ho, P. S. and Kwok, T., Rep. Prog. Phys., 52, 301 (1989).CrossRefGoogle Scholar
3. Rosenberg, R. and Ohring, M., J. Appl. Phys., 42, 5671 (1971).CrossRefGoogle Scholar
4. Shatzkes, M. and Lloyd, J. R., J. Appl. Phys., 59, 3890 (1986).CrossRefGoogle Scholar
5. Korhonen, M. A., Borgesen, P., and Li, C. Y., in Thin Films: Stresses and Mechanical Properties III, edited by Nix, W. D., Bravman, J. C., Arzt, E., and Freund, L. Ben, (Mat. Res. Soc. Symp. Proc., 239, Pittsburgh PA, 1992), pp. 695–700.Google Scholar
6. Sauter, A. I. and Nix, W. D., J. Mater. Res., 7, 1133 (1992).CrossRefGoogle Scholar
7. Huntington, H. B., Kalukin, A., Meng, P. P., Shy, Y. T., and Ahmad, S., J. Appl. Phys., 70, 1359 (1991).CrossRefGoogle Scholar
8. Pantelides, S. T., this volume, previous paper.Google Scholar
9. Ballufli, R. W. and Granato, A. V., in Dislocations in Solids, edited by Nabarro, F. R. N., (North-Holland, Amsterdam, 1979), vol. 4, p. 1.Google Scholar
10. Burnett, D. S., Finite Element Analysis, (Addison-Wesley, Reading MA, 1987).Google Scholar
11. Wait, R. and Mitchell, A. R., Finite ElementAnalysis and Applications, (Wiley, New York, 1985).Google Scholar
12. Herring, C., J. Appl. Phys., 21, 437 (1950).CrossRefGoogle Scholar
13. Dahlquist, G. and Björck, A., Numerical Methods, (Prentice-Hall, Englewood Cliffs NJ, 1974), p. 359.Google Scholar