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Temperature Uniformity Optimization Using Three-Zone Lamp and Dynamic Control in Rapid Thermal Multiprocessor
Published online by Cambridge University Press: 28 February 2011
Abstract
Rapid thermal processing (RTP) can play an important role in in situ single-wafer thermal multiprocessing, since it allows for a rapid wafer throughput rate. Conventional dedicated RTP equipment, where temperature uniformity is achieved by optimized reflector and chamber geometries for a specific process, typically cannot provide uniformity for different processes, or for a range of processing conditions. In this work we present a new flexible lamp system, in which tungsten-halogen lamps are configured in three concentric rings that are independently and dynamically controlled. The resultant circularly symmetric flux, which can be varied and controlled both temporally and spatially, offers significantly improved temperature uniformity. This is demonstrated using thermocouples as well as actual processes such as implant annealing, thermal oxidation and chemical vapor deposition of silicon. Through added flexibility and more precise control, this approach offers a powerful tool for multiprocessing and rapid process prototyping.
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- Copyright © Materials Research Society 1991
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