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Temperature Dependence Of Residual Stresses In Capped Blanket Cu Films Of Various Thicknesses

Published online by Cambridge University Press:  15 February 2011

G. Langelaan ,
S. Saimoto  and
M. Moske
G. Langelaan
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada
S. Saimoto
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada
M. Moske
Affiliation:
Insitut für Physik, Universitat Augsburg, Augsburg, Germany
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Abstract

Residual strains in thin films of 1.0 μm, 0.5 μm and 0.25 μm Cu capped with 24 nm Ta and a 62 nm Ta diffusion barrier were measured using x-rays during continuous temperature ramping. Cycles up to 300°C and 400°C were performed. At ambient temperature, the flow stresses after heating to 400°C were found to increase wth decreasing film thickness. The stresses were sufficiently high below 100°C to cause plastic yielding. The diffracted intensities from the in-plane and out-of-plane (111) planes were recorded with temperature and the intensity changes were attributed to the necessary dislocation density and distribution variation to accomodate the mismatch strain due to thermal expansion differences.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 537
Copyright
Copyright © Materials Research Society 1996

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