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Tem Observations of AG-TI Bilayers After Thermal Aging Treatment in a Reducing Ambient

Published online by Cambridge University Press:  10 February 2011

Adam I. Amali
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287–1704
J.W. Mayer
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287–1704
Yuxiao Zeng
Affiliation:
Department of Chemical, Bio and Materials Engineering Center for Low Power Electronics, Arizona State University, Tempe, AZ 85287–6006
Y.L. Zou
Affiliation:
Department of Chemical, Bio and Materials Engineering Center for Low Power Electronics, Arizona State University, Tempe, AZ 85287–6006
T.L. Alford
Affiliation:
Department of Chemical, Bio and Materials Engineering Center for Low Power Electronics, Arizona State University, Tempe, AZ 85287–6006
F. Deng
Affiliation:
Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, CA 92093
S.S. Lau
Affiliation:
Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, CA 92093
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Abstract

Transmission electron microscopy (TEM) in both cross sectional and plan view is used to study the effect of annealing Ag-Ti bilayers deposited on SiO2/Si substrates in an NH3 ambient. The resulting structure, texture and grain size are investigated. Comparisons are made between films annealed at 400, 500 and 600 °C. Silver films show increasingly strong <111> texture with annealing temperature while exhibiting a bamboo-like grain structure at 600 °C. Considerable grain growth with lateral grain sizes of up to 5 times the thickness of the Ag film is observed at 600 °C. The grains typically extend through the Ag film thickness. The Ti/SiO2 interface uniformity and the absence of voids at the substrate surface are positive indicators of the role of titanium as a good adhesion promoter. At 600 °C, a uniform TiN encapsulation layer is observed on the Ag surface.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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