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Technique to Measure Thermodynamic Adhesion of Copper-Polyimide Interfaces

Published online by Cambridge University Press:  10 February 2011

Marlon E. Menezes ,
I.M. Roberton  and
H.K. Birnbaum
Marlon E. Menezes
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St., Urbana, II. 61801.
I.M. Roberton
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St., Urbana, II. 61801.
H.K. Birnbaum
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St., Urbana, II. 61801.
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Abstract

A contact angle measurement technique has been used to determine the thermodynamic adhesive strength between nano-sized copper clusters and polyimide. The copper clusters are formed under UHV conditions by using ∼ mono-layer per minute deposition rates to assist equilibrium cluster formation. Temperatures of the polyimide substrate during the deposition process are maintained below Tg, which ensures no diffusion of the copper atoms into the polyimide matrix. Values of the strength of adhesion from these contact angle measurements are in reasonable agreement with predictions made using Fowkes’ theory of non-polar interfacial adhesion, but are at least one order of magnitude less than the value obtained by mechanical tests. The limitations of this technique due to deformation at the polyimide surface, as well as kinetic factors constraining equilibrium cluster formation will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 257
Copyright
Copyright © Materials Research Society 1997

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