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Synchrotron X-Ray Study of the Structure of Silicon During Pulsed Laser Processing*
Published online by Cambridge University Press: 15 February 2011
Abstract
Synchrotron x-ray pulses have been used to make nanosecond resolution time-resolved x-ray diffraction measurements on silicon during pulsed laser annealing. Thermal expansion analysis of near-surface strains during annealing has provided depth dependent temperature profiles indicating >1100°C temperatures and diffraction from boron implanted silicon has shown evidence for near-surface melting. These results are in qualitative agreement with the thermal melting model of laser annealing.
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- Copyright © Materials Research Society 1982
Footnotes
Research sponsored by the Division of Materials Sciences, U.S. Department of Energy under contract W-7405-eng-26 with Union Carbide Corporation.
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