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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2

Published online by Cambridge University Press:  26 February 2011

Hiroki Uchiyama ,
Masato Sone ,
Chiemi Ishiyama  and
Yakichi Higo
Hiroki Uchiyama
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, Nagatsuda 4259-R2-35, Midoriku, Yokohama, Kanagawa, Yokohama, 226-8503, Japan, +81-45-924-5043
Masato Sone
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
Chiemi Ishiyama
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
Yakichi Higo
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, 4259 Nagatsuda, Midori-ku, Yokohama, 226-8503, Japan
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Abstract

This paper proposes a novel coating method combining supercritical fluid technology and electroless plating in a hybrid technique. The electroless plating reactions are carried out in an emulsion of supercritical carbon dioxide (sc-CO2) and an electroless plating solution with surfactants. The Ni-P film obtained by this proposed technique was a uniform and conformal film without the pinholes and nodules. The Ni-P film fabricated by our technique was smoother and more uniform than the substrate after pretreatment and the conventional electroless plating.

Keywords

platingNielectrochemical synthesis
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V07-10
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Semiconductor Industry Association, International Technology Roadmap for Semiconductors, 2005 ed. (Semiconductor Industry Association, San Jose, 2005).Google Scholar
2. Schultze, J. W. and Bressel, A., Electrochim. Acta. 47, 3 (2001).Google Scholar
3. Honma, H., Electrochim. Acta. 47, 75 (2001).Google Scholar
4. Mallory, G. O. and Hajdu, J. B., Electroless Plating: Fundamentals & Applications. (American Electroplaters and Surface Finishers Society, Florida, 1990).Google Scholar
5. Vakelis, A., in Coatings Technology Handbook, 3nd ed, edited by Tracton, A. A., (CRC Press Taylor & Francis Group, New York, 2006), p.27–1.Google Scholar
6. Blackburn, J. M., Long, D. P., Cabanas, A. and Watkins, J. J., Science, 294, 141 (2001).Google Scholar
7. Wakayama, H., Fukushima, Y., Chem. Commun., 4, 391 (1999).Google Scholar
8. Yoshida, H., Sone, M., Mizushima, A., Abe, K., Tao, X. T., Ichihara, S., Miyata, S., Chem.Lett., 11, 1086 (2002).Google Scholar
9. Yoshida, H., Sone, M., Mizushima, A., Yan, H., Wakabayashi, H., Abe, K., Tao, X. T., Ichihara, S. and Miyata, S., Surf. Coat. Tech. 173, 285 (2003).Google Scholar
10. Watanabe, H. and Honma, H., J. Electrochem. Soc. 144, 471 (1997).Google Scholar
11. Chang, S. Y., Hsu, C. J., Fang, R.H., Lin, S. J., J. Electrochem. Soc. 150, C603 (2003).Google Scholar
12. Tsunoda, T., Nagashima, H., Nishinakayama, H., Watanabe, H. and Honma, H., Hyomen Gijutsu. 56, 463 (2005).Google Scholar
13. Kobayashi, T., Ishibashi, J., Mononobe, S., Ohtsu, M., and Honma, H., J. Electrochem. Soc. 147, 1046 (2000)Google Scholar
14. Yan, H., Sone, M., Sato, N., Ichihara, S., Miyata, S., Surf. Coat. Tech. 182, 329 (2004).Google Scholar
15. Hsu, H. H., Yeh, J. W. and Lin, S. J., J. Electrochem. Soc. 150, C813 (2003).Google Scholar