Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-25T15:13:52.004Z Has data issue: false hasContentIssue false
  • English
  • Français

Sub-critical telephone cord delamination propagation and adhesion measurements

Published online by Cambridge University Press:  01 February 2011

Alex A. Volinsky ,
Patrick Waters ,
James D. Kiely  and
Earl C. Johns
Alex A. Volinsky
Affiliation:
University of South Florida, Department of Mechanical Engineering, Tampa FL 33620USA, [email protected]; http://www.eng.usf.edu/~volinsky
Patrick Waters
Affiliation:
University of South Florida, Department of Mechanical Engineering, Tampa FL 33620USA, [email protected]; http://www.eng.usf.edu/~volinsky
James D. Kiely
Affiliation:
Seagate Technology, Pittsburgh, PA 15222, USA
Earl C. Johns
Affiliation:
Seagate Technology, Pittsburgh, PA 15222, USA
Get access

Abstract

Thin film delamination can occur when the stored elastic energy per unit area in the film due to the residual stress exceeds the interfacial toughness. Telephone cord morphology is commonly observed in delaminating thin films under compressive stresses. Here, the biaxial film stress is partially relieved by film buckling in the direction perpendicular to the telephone cord propagation, and by “secondary” blister buckling in the direction of telephone cord propagation, which results in the sinusoidal fracture patterns.

A superlayer indentation test, in which additional stress is supplied to the crack tip using a nanoindenter, can be used to measure the interfacial toughness. Estimates of the energy release rate for diamond-like carbon (DLC) films on magnetic media were obtained using the superlayer indentation test, as well as the delaminated buckling profiles. The results obtained by these two independent methods are in good agreement with each other. We find the average adhesion energy to be 6 J/m2 for DLC films on magnetic media.

Normally telephone cord blisters “run out of steam” and stop once the interfacial toughness exceeds the strain energy release rate. It is possible to make blisters propagate further by either putting mechanical energy into the system, or by introducing liquids at the crack tip, thus reducing the film interfacial toughness. Environmental species can assist cracking and contribute to thin film delamination, which is readily observed in vintage mirrors. Crack propagation rates on the order of microns per minute were measured for DLC films in different fluid environments. We identify how telephone cord buckling delamination can be used as a test vehicle for studying crack propagation rates and environmentally assisted cracking in thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 854: Symposium U – Stability of Thin Films and Nanostructures , 2004 , U9.5
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hsu, T.R., MEMS and Microsystems Design and Manufacture, McGraw-Hill, New York, (2002).Google Scholar
2. Ohring, M., The Materials Science of Thin Films, Academic Press, London, (1992).Google Scholar
3. Marshall, D.B., Evans, A.G., J. Appl. Phys., Vol. 56, No. 10, pp. 2632–2638, (1984).Google Scholar
4. Kriese, M.D., Gerberich, W.W., Moody, N.R., J. Mater. Res., Vol. 14, No. 7, pp. 3007–3018, (1999).Google Scholar
5. Volinsky, A.A, Moody, N.R., Gerberich, W.W., Acta Mater., Vol. 50/3, pp.441–466, (2002).Google Scholar
6. Volinsky, A.A., Tymiak, N.I., Kriese, M.D., Gerberich, W.W., Hutchinson, J.W., Mat. Res. Soc. Symp. Proc., Vol. 539, pp. 277–290, (1999).Google Scholar
7. Volinsky, A.A., Mat. Res. Soc. Symp. Proc. Vol. 749, W10.7, (2003).Google Scholar
8. Volinsky, A.A., Meyer, D.C., Leisegang, T., Paufler, P., Mat. Res. Soc. Symp. Proc. Vol. 795, U3.8, (2003).Google Scholar
9. Burolla, V.P., Solar Energy Materials, Vol. 3/1–2, pp. 117–126, (1980).Google Scholar
10. Vlassak, J.J., Lin, Y., Tsui, T. Y., Materials Science and Engineering A, Vol. 391/1–2, pp. 159–174, (2004).Google Scholar
11. Hutchinson, J.W., Suo, Z., Adv. In Appl. Mech., Vol. 29, pp. 63–191 (1992).Google Scholar
12. Oliver, W.C., Pharr, G.M., J. Mater. Res., Vol. 7, No.6, pp. 1564–1580 (1992).Google Scholar
13. Lee, A., Clemens, B.M., Nix, W.D., Acta Materialia, Vol. 52, pp. 2081–2093 (2004).Google Scholar
14. Volinsky, A.A., Waters, P., Wright, G., Mat. Res. Soc. Symp. Proc. Vol. 855E, W3.16, (2004).Google Scholar
15. Moon, M.W., Lee, K.R., Oh, K.H., Hutchinson, J.W., Acta Mater., Vol. 52/10, pp. 3151–3159, (2004).Google Scholar
16. World Wide Web: http://www.eng.usf.edu/~volinsky Google Scholar