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Study of Nucleation of Electroless Cu Deposition on Pd

Published online by Cambridge University Press:  10 February 2011

R. Amster ,
B. Johnson  and
L. S. Vanasupa
R. Amster
Affiliation:
Department of Materials Engineering, Cal Poly, CA 93407
B. Johnson
Affiliation:
Department of Materials Engineering, Cal Poly, CA 93407
L. S. Vanasupa
Affiliation:
Department of Materials Engineering, Cal Poly, CA 93407
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Abstract

We studied the nucleation of Cu deposited by an electroless bath. A Pd seed layer was sputtered onto a (100) Si substrate and analyzed with GIX, STM, and AFM. The seed layer was then placed in varying ED-Cu bath conditions and also analyzed using GIX, STM, and AFM. GIX analysis results show a (111) texture for the Pd seed layer as well as the ED-Cu layer. The seed layer's influence on the deposited Cu grain's texture was found to be inconclusive.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 451: Symposium P – Electrochemical Synthesis and Modification , 1996 , 451
Copyright
Copyright © Materials Research Society 1997

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References

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