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Structure And Properties Of Binary Rodlike/Flexible Polyimide mixtures.

Published online by Cambridge University Press:  15 February 2011

S. Rojstaczer ,
M. Ree ,
D Y. Yoon  and
W. Volksen
S. Rojstaczer
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120
M. Ree
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120
D Y. Yoon
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120
W. Volksen
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120
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Abbstract:

Binary mixtures of a rodlike poly(p-phenylene pyromellitimide) (PMDA-PDA) and a flexible 6F-BDAF polyimide synthesized from hexafluoroisopropylidene diphthalic anhydride and 2,2-bis(4-aminophenoxy-p-phenylene) hexafluoropropane were prepared by solution-blending of the meta-PMDA-PDA poly(amic ethyl ester) and 6F-BDAF poly(amic acid) precursors, followed by solvent evaporation and thermal imidization. The size scale of the phase separation, as measured by light scattering, is ca. I μm or smaller in most cases. Dynamical mechanical thermal analysis measurements indicate that the glass transition temperature of 6F-BDAF is unaffected in all of the mixtures studied, indicating complete demixing of rodlike and flexible polyimides in agreement with theory. X-ray photoelectron spectroscopy results show a strong surface segregation of 6F-BDAF in mixtures containing as low as 10% by weight of the 6F-BDAF component in the bulk. The mixtures with PMDA-PDA as the major matrix component therefore maintain excellent bulk properties of rodlike polymers, i.e., high modulus to 500°C, and low coefficients of thermal expansion (< ca. 10 ppm/°C). On the other hand, the surface properties of the mixtures are dominated by the flexible 6F-BDAF, resulting in excellent polymer/polymer self-adhesion (lamination) properties between fully imidized films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 371
Copyright
Copyright © Materials Research Society 1991

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References

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