Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-25T17:40:39.912Z Has data issue: false hasContentIssue false
  • English
  • Français

Structure and Magnetic Properties of Fe/Cu Multilayered Thin Film

Published online by Cambridge University Press:  26 February 2011

A. Fukizawa  and
M. Naoe
A. Fukizawa
Affiliation:
Central Res. Lab. Showa Denko K.K., Tokyo 146, JAPAN.
M. Naoe
Affiliation:
Dept. of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo 152, JAPAN.
Get access

Abstract

Fe/Cu multilayered films prepared by means of Facing Targets Sputtering have distinct multilayered structure at layer thicknesses above 7Å. The saturation magnetization of Fe in the multilayered film takes almost the bulk thicknesses Fe value above this thickness. However, multilayerd structures did not clearly form at layer thicknesses below 7Å and the saturation magnetization decreased to about half of the bulk value. Considerable variation of confirmed layer thickness, saturation magnetization and coercivity in the multilayerd films were obtained when the total thickness was below 1000Å.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 77: Symposium D – Interfaces, Superlattices, and Thin Films , 1986 , 687
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES:

1. Shinjo, T., Kawaguchi, B., Yamamoto, R., Hosoito, N. and Tanaka, T., Solid State Commun., 52, 257 (1984).Google Scholar
2. Katayama, T., Nishihara, Y., Awano, H., Itoh, A. and Kawashima, K., abstracts on the Int. Conf. Magn. and Magn. Mat., HB-12(1986); to be published in J. Appl. Phys., April (1987).Google Scholar
3. Drraisma, H.J., Van Noort, H.M. and Den Broeder, F.J.A., Thin Solid Films, 126, 117 (1985).Google Scholar
4. Thornton, J.A., in Deposition Technologies for Films and Coatings, edited by Bunshah, R.F., et.al., (Noyes Publications, New York, 1982).Google Scholar
5. Hoshi, Y., Naoe, M. and Yamanaka, S., Jpn. J. Appl. Phys., 16, 15(1977).Google Scholar
6. Nakagawa, S. and Fukizawa, A., (Unpublished data).Google Scholar
7. Hirata, H., Kaku, S. and Naoe, M., Mat. Res. Soc. Symp. Proc., 56, 305(1986).Google Scholar
8. Wiartolla, W., Becker, W., Keune, W. and Pfnnes, H.D., J. Phys., 45,(C5), 461 (1984).Google Scholar
9. Montano, P.A., Lee, Y.C., Marcano, J. and Min, H., Mat. Res. Soc. Symp. Proc., 56, 183 (1986).CrossRefGoogle Scholar
10. Kozono, Y., Romura, M., Narishige, S. and Hanazono, M., J. Magn. Soc. Jpn., 10 (2), 287(1985).Google Scholar
11. Messier, R., J. Vac. Sci. Technol., A4, (3), 490(1986).Google Scholar
12. Nakayama, N. and Shinjo, T., presented at Symp. on the Function and Structure of Metal Thin Film, supported by Jpn. Metal Soc., 1986, (Unpublished).Google Scholar
13. Kazana, N.S., Fujimori, H., Yuito, I. and Kronmuller, H., IEEE Tran. on Mag. Vol. MAG-20, 5, 1296 (1984).Google Scholar
14. Nittono, O., Bulletin of Jpn. Metal Soc. 25 (10), 858(1986).Google Scholar