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Structural Reliability of Direct-Chip-Attaches Bonded With Anisotropic Conductive Film

Published online by Cambridge University Press:  10 February 2011

D.C.C. Lam ,
C. Shen ,
JF Xie, Z. Karim  and
P. Tong
D.C.C. Lam
Affiliation:
Mechanical Engineering Dept., Center for Advanced Engineering Materials and
C. Shen
Affiliation:
Mechanical Engineering Dept., Center for Advanced Engineering Materials and
JF Xie, Z. Karim
Affiliation:
Electrical and Electonic Engineering Dept., Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong
P. Tong
Affiliation:
Mechanical Engineering Dept., Center for Advanced Engineering Materials and
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Abstract

Structural reliability is a major concern in using anisotropic conductive films (ACF) in the electrical connection of chips or chip carriers to substrates. The relationship between electrical and structural failure is experimentally examined using a custom designed test chip. In-situ electrical measurements along with post failure microstructural examination revealed that electrical failure (open circuit) is caused by interfacial cracking of ACF/bump interface. An engineering analysis of the influence of assembly geometry revealed that tall relative bump height and large underbump adhesive thickness decrease the driving force for interfacial cracking. However, when relative bump height is increased and underbump adhesive thickness is reduced, increased compression from increased relative bump height dominate over increased shear resulting in a net decrease in crack propagation driving force. In general, tall relative bump height can reduce the potential for electrical failure in ACF interconnect when the ACF/bump interfacial fracture is the dominant failure mode.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 297
Copyright
Copyright © Materials Research Society 1997

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