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Structural and Electrical Characterization of U Ltra-Thin SiO2 Grown on Hydrogen-Terminated Silicon Surfaces

Published online by Cambridge University Press:  21 February 2011

M. Hirose
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 724, Japan
T. Yasaka
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 724, Japan
M. Hiroshima
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 724, Japan
M. Takakura
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 724, Japan
S. Miyazaki
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 724, Japan
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Abstract

The surface microroughness of Si(100) wafers has been studied by FT-IR-ATR. The final wafer clean in an 0.1% HF + 1% H2O2 aqueous solution significantly improves the hydrogenterminated surface morphology as demonstrated by a sharp SiH2 stretching vibration peak accompanied with the weak SiH and SiH3 peaks. The ultra-thin gate oxide grown on such surface exhibits nearly ideal tunneling current transport. The cleaning in 4.5% HF reduces the SiH2 peak height and enhances SiH3, making the surface rough. Nevertheless, the tunneling characteristics are hardly influenced with such spectral change.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

[1] Morita, M., Ohmi, T, Hasegawa, E., Kawakami, M. and Suma, K., Appl. Phys. Lett. 55 562(1989).Google Scholar
[2] Yasaka, T., Takakura, M., Miyazaki, S. and Hirose, M., Mat. Res. Soc. Symp. Proc. 222 225 (1991).Google Scholar
[3] Homma, Y, Suzuki, M. and Yabumoto, N., J. Vac. Sci. Technol. 10 2055 (1992).Google Scholar
[4] Takahagi, T., Nagai, I., Ishitani, A., Kuroda, H. and Nagasawa, Y, J. Appl. Phys. 64 3516 (1988).Google Scholar
[5] Burrows, V. A., Chabal, Y. J., Higashi, G. S., Raghavachari, K. and Christman, S. B. Appl. Phys. Lett. 53 998 (1988).Google Scholar
[6] Higashi, G. S., Chabal, Y. J., Trucks, G. W. and Raghavachari, K., Appl. Phys. Lett. 56 656 (1990).Google Scholar
[7] Makihara, K., Teramoto, A., Nakamura, K., Morita, M. and Ohmi, T: Extended Abstracts of 1992 Intern. Conf. on Solid State Devices and Materials (1992, Tsukuba) p. 120.Google Scholar
[8] Yasaka, T., Kanda, K., Sawara, K., Miyazaki, S. and Hirose, M., Jpn. J. Appl. Phys. 30 3567 (1991).Google Scholar
[9] Watanabe, S., Shigeno, M., Nakayama, N. and Ito, T., Jpn. J. Appl. Phys. 30 3567 (1991).Google Scholar
[10] Sawara, K., Yasaka, T., Miyazaki, S. and Hirose, M., Jpn. J. Appl. Phys. 31 931 (1992).Google Scholar
[11] Ohmi, T., Miyashita, M., Itano, M., Imaoka, T. and Kawanabe, I., IEEE Trans. Electron Devices 39 537 (1992).CrossRefGoogle Scholar
[12] Lucovsky, G., Fitch, J. T, Kobeda, E. and Irene, E. A., Proc. of the Symp. at the 173rd Meeting of the Electrochem. Soc. (Atlanta, 1988) p. 139.Google Scholar