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Strength Measurement in Brittle Thin Films

Published online by Cambridge University Press:  01 February 2011

Oscar Borrero-Lopez
Affiliation:
[email protected], University of New South Wales, Sydney, Materials Science and Engineering, School of Materials Science & Engineering, UNSW Gate 2, High Street, Kensington NSW 2052 Australia, Sydney, N/A, Australia
Mark Hoffman
Affiliation:
[email protected], University of New South Wales, Sydney, NSW 2025, Australia
Avi Bendavid
Affiliation:
[email protected], CSIRO, Materials Science and Engineering, Lindfield, NSW 2070, Australia
Phil J Martin
Affiliation:
[email protected], CSIRO, Materials Science and Engineering, Lindfield, NSW 2070, Australia
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Abstract

In this work we have investigated the strength variability of brittle thin films (thickness ≤ 1 μm) utilising a simple test methodology. Nanoindentation of as-deposited tetrahedral amorphous carbon (ta-C) and Ti-Si-N nanocomposite films on silicon substrates followed by cross-sectional examination of the damage with a Focused Ion Beam (FIB) Miller allows the occurrence of cracking to be assessed in comparison with discontinuities (pop-ins) in the load-displacement curves. Strength is determined from the critical loads at which cracking occurs using the theory of plates on a soft foundation. This is of great relevance, since the fracture strength of thin films ultimately controls their reliable use in a broad range of functional applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

1 Chasiotis, I. and Knauss, W. G., Exp. Mech. 42 (2002) 51.Google Scholar
2 Espinosa, H. D., Peng, B., Moldovan, N., Friedmann, T. A., Xiao, X., Mancini, D. C., Auciello, O., Carlisle, J., Zorman, C. A., and Merhegany, M., Appl. Phys. Lett. 89 (2006) 073111.Google Scholar
3 Namazu, T., Isono, Y. and Tanaka, T., J. Microelectromech. S. 9 (2000) 450.Google Scholar
4 Sharpe, W. N. Jr., Yuan, B. and Edwards, R. L., J. Microelectromech. S. 6 (1997) 193.Google Scholar
5 Sundararajan, S. and Bhushan, B., Sensor Actuat. A-Phys. 101 (2002) 338.Google Scholar
6 Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., J. Microelectromech. S. 7 (1998) 106.Google Scholar
7 Chai, H., Lawn, B. and Wuttiphan, S., J. Mater. Res. 14 (1999) 3805.Google Scholar
8 Rhee, Y. W., Kim, H. W., Deng, Y. and Lawn, B. R., J. Am. Ceram. Soc. 84 (2001) 1066.Google Scholar
9 Borrero-López, O., Hoffman, M., Bendavid, A. and Martin, P. J., Acta Mater. In Press (2008).Google Scholar
10 Kim, J. H., Lee, H. K. and Kim, D. K., Philos. Mag. 86 (2006) 5383.Google Scholar