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The Strength and Ductility of Intermetallic Compounds: Grain Size Effects

Published online by Cambridge University Press:  28 February 2011

E.M. Schulson ,
I. Baker  and
H.J. Frost
E.M. Schulson
Affiliation:
Thayer School of Engineering, Dartmouth College, Hanover, New Hampshire 03755
I. Baker
Affiliation:
Thayer School of Engineering, Dartmouth College, Hanover, New Hampshire 03755
H.J. Frost
Affiliation:
Thayer School of Engineering, Dartmouth College, Hanover, New Hampshire 03755
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Abstract

Since writing on this subject two years ago [1], a number of developments have occurred, particularly in relation to the mechanical properties of the L12 nickel aluminide Ni3Al. Some elucidate the nature of the yield strength and the extraordinarily beneficial effect of boron on low-temperature ductility. Some others expose, at least in part, the nature of the marked reduction in ductility at elevated temperatures. Another considers the mechanisms dominating creep deformation. Also during this period, contradictions have appeared: the relationship between the yield strength and the grain size, d, at room temperature has been contested, and opposing views of grain refinement on ductility have been reported.

This paper reviews these developments. Although broadly directed at intermetallic compounds, the discussion is specific to Ni3Al. The hope is that the knowledge and understanding gained about this compound will benefit the class as a whole.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 81: Symposium H – High-Temperature Ordered Intermetallic Alloys II , 1986 , 195
Copyright
Copyright © Materials Research Society 1987

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References

REFERENCES

1. Schulson, E.M., Mat. Res. Soc. Symp. Proc., 39,194 (1985).Google Scholar
2. Weihs, T.P., Zinoviev, V., Viens, D.V. and Schulson, E.M., Acta Met. (in press).Google Scholar
3. Liu, C.T., White, C.L. and Horton, J.A., Acta Met., 33, 213 (1985).Google Scholar
4. Hanada, S., Watanabe, S. and Izumi, O., J. Mat. Sci., 21, 203 (1986).Google Scholar
5. Oya, Y., Mishima, Y., Yamada, K. and Suzuki, T., Report Tokyo Institute of Technology, March 1984, pp. 37–49.Google Scholar
6. Schulson, E.M., Weihs, T.P., Baker, I., Frost, H.J. and Horton, J.A., Acta Met., 34, 1395 (1986).Google Scholar
7. Schulson, E.M., Weihs, T.P., Viens, D.V. and Baker, I., Acta Met., 33 1587 (1985).Google Scholar
8. Huang, S.C., Taub, A.I. and Chang, K.-M., Acta Met., 32, 1703 (1984).Google Scholar
9. Schulson, E.M., Int. Met. Rev., 29, 195 (1984).Google Scholar
10. Staton, A.E.-Bevan and Rawlings, R.D., Phys. Stat.Sol., 29 613 (1975).Google Scholar
11. Suzuki, T., Oya, Y. and Ochiai, S., Met. Trans. 15A, 173 (1984).CrossRefGoogle Scholar
12. Miller, M.K. and Horton, J.A., Scripta Met. 20, 789 (1986).Google Scholar
13. Baker, I., Schulson, E.M. and Horton, J.A., Acta Met. (in press).Google Scholar
14. Johnston, T.L., Davies, R.G. and Stoloff, N.S., Phil. Mag., 12, 305 (1965).CrossRefGoogle Scholar
15. Takasugi, T. and Izumi, O., Acta Met., 31, 1187 (1983).Google Scholar
16. Frost, H.J., Acta Met. 35 (1987) 519.CrossRefGoogle Scholar
17. Aoki, K. and Izumi, O., Nippon Kinzoku Gakkaishi, 43, 1190 (1979).Google Scholar
18. Chen, S.P., Voter, A.F. and Strolovitz, D.J., Scripta Met., 20, 1389 (1986).Google Scholar
19. Taub, A.I., Huang, S.C. and Chang, K.-M., MRS Symp. Proc., 39, 221 (1985).Google Scholar
20. Liu, C.T. and White, C.L., Acta Met. (in press); also Scripta Met., 19, 1247 (1985).Google Scholar
21. Taub, A.I., Chang, K.-M. and Liu, C.T., Scripta Met., 20, 1613 (1986).Google Scholar
22. Woodford, D.A. and Bricknell, R.H., Treatise on Materials Sci. and Tech., “Embrittlement of Structural Materials,” ed. Briant, C.L., Acad. Press, N.Y., 25, 157 (1983).Google Scholar
23. Schneibel, J.H., Petersen, G.F. and Liu, C.T., J. Mat. Res., 1, 68 (1986).Google Scholar