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Strain Relaxation in Epitaxial Heterostructures: Sensitivity of High Resolution X-Ray Diffraction

Published online by Cambridge University Press:  25 February 2011

M. S. Goorsky
Affiliation:
Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA
S. T. Horng
Affiliation:
Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA
S. R. Sriffler
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY.
C. S. Stanis
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY.
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Abstract

Comparison of high resolution x-ray diffraction and transmission electron microscopy measurements of Si-based heterostructures demonstrates that diffraction is much more sensitive to strain relaxation than previously reported. This study used as-grown and annealed Si1-x Gex structures grown on (001) Si by UHV/CVD. (004), (113), and (115) rocking curves were employed. Using the TEM measurements as a quantitative guide, relaxation was observed in rocking curves when the misfit dislocation line density was as low as 1 μ-1. Also, interference fringes strongly depend on the presence of interfacial defects. At higher dislocation densities, the diffraction peak from the epitaxial layer broadens considerably but does not shift to a position that represents complete relaxation. Broadening of the substrate diffraction peak also occurs, which is due to dislocations that loop into the substrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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