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Stiffness Improvements and Molecular Mobility in Epoxy-Clay Nanocomposites

Published online by Cambridge University Press:  01 February 2011

X. Kornmann ,
L. A. Berglund  and
H. Lindberg
X. Kornmann
Affiliation:
Division of Polymer Engineering, Luleå University of Technology, S-97187 Luleå, Sweden
L. A. Berglund
Affiliation:
Division of Polymer Engineering, Luleå University of Technology, S-97187 Luleå, Sweden
H. Lindberg
Affiliation:
Division of Wood Material Science, Luleå University of Technology, S-93187 Skellefteå, Sweden
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Abstract

Conventional composites filled with clay as well as intercalated nanocomposites, and exfoliated nanocomposites based on a glassy epoxy matrix have been synthesised. Flexural moduli of these materials were measured in three-point bending at various clay contents. For a given clay content, stiffness improvements depended not only on the dispersion of the clay on the microscale, but also on the exfoliation of the clay layers at the nanolevel. Dynamic mechanical measurements indicated a decrease of intensity in the glass transition peak with the extent of exfoliation of the clay and the clay content, suggesting a restriction of the molecular mobility of the polymer in the vicinity of the clay layers. A shift in Tg of 20°C towards lower temperature for the epoxy resin cured at 160°C was possibly caused by thermal degradation of compatibilizing agents at high temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 628: Symposium CC – Hybrid Organic/Inorganic Materials , 2000 , CC11.8
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Wang, Z. and Pinnavaia, T. J., Chem. Mater.,, 10, 1820 (1998).Google Scholar
2. Okada, O. and Usuki, A., Mater. Sci. Eng.,, C3, 109 (1995).Google Scholar
3. Yano, K., Usuki, A., and Okada, A., J. Polym. Sci. A: Polym. Chem.,, 35, 2289 (1997).Google Scholar
4. Okada, A., Kawasumi, M., Usuki, A., Kojima, Y., Kurauchi, T., and Kamigaito, O., Mater. Res. Soc. Proc.,, 171, 45 (1990).Google Scholar
5. Kojima, Y., Usuki, A., Kawasumi, M., Okada, A., Fukushima, Y., Kurauchi, T., and Kamigaito, O., J. Mater. Res.,, 8, 1185 (1993).Google Scholar
6. Lan, T. and Pinnavaia, T. J., Chem. Mater.,, 6, 2216 (1994).Google Scholar
7. Massam, J. and Pinnavaia, T. J., Mat. Res. Symp. Proc.,, 520, 223 (1998).Google Scholar
8. Kornmann, X., Lindberg, H., and Berglund, L., submitted to J. Polym. Sci.: Part A. Google Scholar
9. Kornmann, X., Lindberg, H., and Berglund, L., submitted to Polymer. Google Scholar
10. Tsagaropoulos, G. and Eisenberg, A., Macromolecules,, 28, 6067 (1995).Google Scholar
11. Heux, L., Halary, J. L., Lauprêtre, F., and Monnerie, L., Polymer,, 38, 1767 (1997).Google Scholar