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Status and Opportunities for High Efficiency OLED Displays on Flexible Substrates

Published online by Cambridge University Press:  01 February 2011

Michael Hack
Affiliation:
Universal Display Corporation, Ewing, New Jersey
Anna Chwang
Affiliation:
Universal Display Corporation, Ewing, New Jersey
Yeh-Jiun Tung
Affiliation:
Universal Display Corporation, Ewing, New Jersey
Richard Hewitt
Affiliation:
Universal Display Corporation, Ewing, New Jersey
Julie Brown
Affiliation:
Universal Display Corporation, Ewing, New Jersey
JengPing Lu
Affiliation:
Palo Alto Research Center, Palo Alto, California;
Chinwen Shih
Affiliation:
Palo Alto Research Center, Palo Alto, California;
Jackson Ho
Affiliation:
Palo Alto Research Center, Palo Alto, California;
R. A. Street
Affiliation:
Palo Alto Research Center, Palo Alto, California;
Lorenza Moro
Affiliation:
Vitex Systems, Inc., San Jose, California
Xi Chu
Affiliation:
Vitex Systems, Inc., San Jose, California
Todd Krajewski
Affiliation:
Vitex Systems, Inc., San Jose, California
Nicole Rutherford
Affiliation:
Vitex Systems, Inc., San Jose, California
Robert Visser
Affiliation:
Vitex Systems, Inc., San Jose, California
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Abstract

OLEDs are an ideal technology for electronic display applications. They are fabricated by depositing very thin films of organic materials at low temperatures (<100°C) to form bright, vivid power efficient self-emissive light producing elements with fast response times that can be grown on a variety of large area substrates such as glass, plastic or metal foil. These properties make OLEDs ideally suited to enable high information content flexible displays. In particular, the application of phosphorescent OLEDs leads to very low power consumption displays – a key requirement for mobile applications. In this paper we outline our progress towards developing low power consumption, active-matrix flexible OLED (FOLED™) displays. Our work is focused on integrating three critical enabling technologies: high efficiency long-lived top emission phosphorescent OLED (PHOLED™) device technology, flexible active-matrix backplanes, and thin film encapsulation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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