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A Spectromicroscopic Study of Corrosion in AI-Cu-Si Metallization

Published online by Cambridge University Press:  21 February 2011

S. Liang ,
A.K. Ray-Chaudhuri ,
W. Ng ,
S. Singh ,
J.T. Welnak  and
F. Cerrina
S. Liang
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
A.K. Ray-Chaudhuri
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
W. Ng
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
S. Singh
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
J.T. Welnak
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
F. Cerrina
Affiliation:
Center for X-ray Lithography, University of Wisconsin - Madison, 3731 Schneider Dr., Stoughton, WI 53589
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Abstract

Soft X-ray photoelectron spectromicroscopy has been employed to examine the microstructural chemistry of corrosion on thin films of AL-i%Cu-1%Si alloy. Cu-rich precipitates are formed after the film is annealed at around 320ºC Localized corrosion takes place around these precipitates, and circular microstructures have been observed. Energy distribution curves (EDCs) taken at specific points are analyzed and photoelectron images were obtained from different kinetic energies corresponding to the peaks in EDC. It was found that after corrosion the Al2Cu particles are revealed and distributed at the center of the corrosion structure with oxide as matrix, while the oxides form a ring-like band outside.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 449
Copyright
Copyright © Materials Research Society 1993

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