Published online by Cambridge University Press: 26 February 2011
We have studied the spatial profile of the thermal transients that occur during and following the current pulsing associated with Peltier Interface Demarcation during directional solidification. Results for pure Bi are presented in detail and compared with corresponding results for the Bi/MnBi eutectic. Significant thermal transients occur throughout the sample that can be accounted for by the Peltier effect, the Thomson effect, and Joule heating. We have separated these effects and studied their behavior as a function of time, current density, and position with respect to the solid/liquid interface.