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Solvent diffusion in porous low-k dielectric films

Published online by Cambridge University Press:  01 February 2011

Denis Shamiryan  and
Karen Maex
Denis Shamiryan
Affiliation:
IMEC, Kapeldreef 75, Leuven, 3001, Belgium, also at Electrical Engineering department of K.U.Leuven
Karen Maex
Affiliation:
IMEC, Kapeldreef 75, Leuven, 3001, Belgium, also at Electrical Engineering department of K.U.Leuven
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Abstract

Porous materials are being investigated as low dielectric constant (low-k) materials. While porosity decreases the k-value of a material by decreasing its density, it simultaneously allows unwanted adsorption and diffusion of chemicals inside the porous matrix. To investigate this, different porous low-k materials, specifically silicon oxycarbide (SiOCH), methylsilsesquioxane (MSQ), and a polymer, were exposed to polar (ethanol) and non-polar (toluene) solvents. A difference in diffusion of polar and non-polar solvents would be an indication of the density of polar centers which attract polar molecules (such as water) and increase the dielectric constant of a film. The diffusion coefficient for toluene at room temperature was found to be approximately 2×10-5 cm2/sec for MSQ (40% porosity), 10-7 cm2/sec for SiOCH (7% porosity), 2×10-8 cm2/sec for the polymer. The observed diffusion can be described by a model of a viscous flow in a porous medium. The toluene/ethanol diffusion coefficient ratios were 4.4, 1.3, 1 for MSQ, SiOCH, and the polymer, respectively. The difference in toluene/ethanol diffusion can potentially be used to screen a material's affinity for water adsorption.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 766: Symposium E – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 , 2003 , E9.11
Copyright
Copyright © Materials Research Society 2003

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