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Solutions and Discussions of thin film Undergoing the Nonlinear Peeling

Published online by Cambridge University Press:  01 February 2011

Yueguang Wei ,
Siqi Shu  and
Ying Du LNM
Yueguang Wei
Affiliation:
Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, P.R. China
Siqi Shu
Affiliation:
Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, P.R. China
Ying Du LNM
Affiliation:
Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, P.R. China
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Abstract

Based on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U4.5
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Spies, GJ. J. Aircraft Eng., 25, 64(1953).Google Scholar
2. Feliu-Baez, R, Lockhart, HE, Burgess, G. Packaging Tech. Sci., 14, 63(2001).Google Scholar
3. Choi, JW, Oh, TS. J. Adhe. Sci. Tech., 15, 139(2001).Google Scholar
4. Asai, H, Iwase, N, Suga, T. IEEE Trans. on Adv. Packaging, 24, 104(2001).Google Scholar
5. Kim, KS, Aravas, N. Int. J. Solids Struct., 24, 417(1988).Google Scholar
6. Kim, J, Kim, KS, Kim, YH. J. Adhe. Sci. Tech., 3, 175(1989).Google Scholar
7. Kinloch, AJ, Lau, CC, Williams, JG. Int. J. Fracture, 66, 45(1994).Google Scholar
8. Moidu, AK, Sinclair, AN, Spelt, JK. J. Testing Evalu., 26, 247(1998).Google Scholar
9. Wei, Y, Hutchinson, JW. Int. J. Fracture, 93, 315(1998).Google Scholar
10. Wei, Y, Hutchinson, JW. In Encyclopedia of Comprehensive Structural Integrity, 8, eds. Gerberich, WW and Yang, W, Chapter 5, Elsevier Science Publisher, 181(2003).Google Scholar